• Descum: Removing residues from photoresist (PR) or polyimide (PI) after development.
• Removal of laser released layers.
• Dry etching of ABF.
• Plasma polishing to remove damage layers on SiC chips after grinding.

• It can be configured with EFEM (Equipment Front End Module) to directly dock two chambers, minimizing cleanroom space requirements and maximizing efficiency.
• It can be combined with other applications using a single transfer chamber, accommodating up to six chambers for different purposes.
• Highly customizable chamber configurations based on customer requirements.
• Equipped with SECS / GEM for automation.