• Integration with EFEM. Four load ports and two thermal slide debonding stations.
• Equipped with robot / aligner.
• Equipped with one set of cleaner.
• Optional wafer pickup based on customer requirements.
• Equipped with SECS / GEM for automation.
• It can be combined with a bonder as a combo machine.
• Suitable for debonding applications in GaAs, GaN, LED, and 3DIC processes.