• Integration with EFEM. Three load ports and two bonder.
• Equipped with robot / aligner.
• One set of coater with EBR functionality.
• One Pre-baking stage.
• Flexibility to use either wax or glue based on customer requirements.
• Equipped with SECS / GEM for automation.
• It can be combined with a De-Bonder as a combo machine.
• Suitable for bonding applications in GaAs, GaN, LED, and 3DIC processes.